| 摘要 |
PURPOSE: An apparatus and a method for processing a single wafer type substrate are provided to improve dry efficiency by airtightly comprising a dry chamber. CONSTITUTION: A single wafer type substrate device(100) includes a cleaning chamber(130), a dry chamber(150), a spin chuck(121), and a door(135,151). The cleaning chamber cleans a substrate. The dry chamber is positioned around the cleaning chamber and dries the cleaned substrate. The substrate is loaded on the spin chuck which rotates and linearly moves in the cleaning chamber and the dry chamber. The door is positioned between the cleaning chamber and the dry chamber, covers the dry chamber tightly for drying the substrate and is opened for the linear movement of the spin chuck.
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