发明名称 |
Method for manufacturing multilayer chip capacitor |
摘要 |
A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.
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申请公布号 |
US7644480(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20070822189 |
申请日期 |
2007.07.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM HYOUNG HO;SHIN HYO SOON;CHOO HO SUNG |
分类号 |
H01G4/005 |
主分类号 |
H01G4/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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