发明名称 Method for manufacturing multilayer chip capacitor
摘要 A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.
申请公布号 US7644480(B2) 申请公布日期 2010.01.12
申请号 US20070822189 申请日期 2007.07.03
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HYOUNG HO;SHIN HYO SOON;CHOO HO SUNG
分类号 H01G4/005 主分类号 H01G4/005
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