发明名称 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
摘要 |
A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up solder balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
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申请公布号 |
US7644853(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20050243677 |
申请日期 |
2005.10.05 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
COBBLEY CHAD A.;BALL MICHAEL B.;WADDEL MARJORIE L. |
分类号 |
B23K5/00;B23K3/06;H05K3/34 |
主分类号 |
B23K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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