发明名称 |
Dicing/die-bonding film, method of fixing chipped work and semiconductor device |
摘要 |
A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer. |
申请公布号 |
US7646103(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20060369931 |
申请日期 |
2006.03.07 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MATSUMURA TAKESHI;MIZUTANI MASAKI |
分类号 |
H01L21/00;H01L21/78;C09J5/00;H01L21/301;H01L21/58;H01L21/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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