发明名称 |
Method and structure for reducing prior level edge interference with critical dimension measurement |
摘要 |
A method for reducing edge effect interference with critical dimension (CD) measurement of semiconductor via structures includes forming a test structure in a kerf region of a semiconductor wafer, the test structure including at least a via structure and a trench structure in contact with the via structure. The via structure is formed in accordance with a critical dimension associated with a corresponding via structure in a circuit region of the semiconductor wafer, and the trench structure is formed in accordance with a widened dimension with respect to a minimum ground rule dimension associated with a corresponding trench structure in a circuit region of the semiconductor wafer.
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申请公布号 |
US7645620(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20050163229 |
申请日期 |
2005.10.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MARTIN ALEXANDER L.;SOLECKY ERIC P. |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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