发明名称 BONDED STRUCTURE AND METHOD OF PRODUCING THE SAME
摘要 <p>PURPOSE: A coupling structure and a manufacturing method thereof are provided to obtain high coupling structure with high connection reliability of the terminal, the printed electrode, and a solder coupling layer by not forming a brittleness layer on an interface between the terminal and the solder coupling layer. CONSTITUTION: A printed electrode(2) comprised of high fusion conductive material carbide and alumina is laid. A ceramics unit(4) forms a terminal hole ranging from a bottom part of a concave part to the printed electrode and is made of the alumina as a main component. A terminal(3) is arranged on the terminal hole to contact a first main surface with the printed electrode and expose a second main surface to the bottom part of the concave part. A solder coupling layer(6) is installed on the concave part to contact with the second main surface. A connection unit(5) is inserted into the concave part to contact with the solder coupling layer and is made of the high fusion metal with the similar thermal expansion coefficient with the ceramics unit. The terminal includes the alumina of 5 to 60 mass % based on the overall mass.</p>
申请公布号 KR20100003707(A) 申请公布日期 2010.01.11
申请号 KR20090059246 申请日期 2009.06.30
申请人 NGK INSULATORS, LTD. 发明人 HATTORI AKIYOSHI;NAKANISHI HIROKAZU
分类号 H01L21/683 主分类号 H01L21/683
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