| 摘要 |
PURPOSE: A photographing method for inspecting a semiconductor chip package image is provided to improve inspection productivity by repeating the photographing by an area camera in a stage transfer process. CONSTITUTION: A controller produces all photographing positions together(S300). An area camera is transferred to an initial position for photography according to the operation of a second motor(S310). A stage is transferred to an end of a palette along a Y axis according to the operation of the first motor(S320). The controller transmits the photographing command to the area camera at an opposite direction to the produced photographing position(S322). The area camera performs the photography according to the reception of the photographing command(S324). The area camera is transferred along the other axial direction and photographs a semiconductor chip package.
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