| 摘要 |
PURPOSE: A light emitting device is provided to improve heat dissipation by dispersing the heat from a light emitting chip by forming several legs on a lead frame. CONSTITUTION: A package body(120) is comprised of a reflector(123) with an opening unit emitting the light from a light emitting chip and a housing(121). A first lead frame and a second lead frame are separated and are connected to the light emitting chip inside the opening. The first and second lead frames form at least two legs forming the electric contact to the outside of the package body. An upper leg(131,141) is protruded to the upper side of the package body and is bent forward or backward. A lower leg(133,143) is protruded to the lower side of the package body and is bent forward and backward. The legs formed on the first lead frame and the second lead frame are positioned on the surface symmetrical places.
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