| 摘要 |
<p>PURPOSE: A light emitting diode module is provided to improve coupling with a wire and a lead pin for wiring with the outside by easily applying various wiring structures. CONSTITUTION: An insulation layer(114) is formed on a base plate(112) made of the metal material. A main board(110) for heat radiation has a main conductive pattern(116) made of a conductive material on the insulation layer. A light emitting diode chip(180) is mounted on the chip mounting region on the main board for the heat radiation. A terminal pad(134) is formed around an external contact hole passing through the upper surface of the exposed part of the main board. A wiring pattern electrically wires the terminal pad and the main conductive pattern. A reflector is bonded on the circuit board to concentrate the beam diffused to the surroundings from the light emitting diode chip.</p> |
