| 摘要 |
A LED encapsulation structure comprises a double-layer substrate, at least a chip, at least two connecting wires, and glue for coating and binding the chip and the connecting wires on the double-layer substrate, wherein the double-layer substrate is equipped with a conducting pattern on an insulating layer and coasted with an isolation glue on the top surface, a binding area and a plurality of electrode areas are preserved on the top surface when coating the isolation glue, so as to bind a chip in the binding area. Meanwhile, the chip is connected and conducted through the two connecting wires and the conducting pattern, and encapsulated in the binding area through glue, so as to finish the encapsulation structure of LED. |
