发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A light emitting diode package is provided to suppress an overvoltage applied to an emitting device by arranging a TVS diode around the light-emitting diode package. CONSTITUTION: A light-emitting diode package(100B) comprises a package body(110) and lead frames(131,132). The lead frame is arranged in the package body. The light-emitting diode package more includes the emitting device(120B) and the TVS diode(140). The emitting device is electrically connected to the lead frames. The TVS diode is electrically connected to the lead frames.
申请公布号 KR20100003320(A) 申请公布日期 2010.01.08
申请号 KR20080059517 申请日期 2008.06.24
申请人 LG INNOTEK CO., LTD. 发明人 AN, JOONG IN
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项
地址