<p>PURPOSE: An LED package is provided to reduce the loss of the light generated from an LED chip by discharging the light from the LED chip to the outside through a sealing agent and an optical fiber. CONSTITUTION: A package body(21) has a cavity to expose a first lead frame(22) and a second lead frame(23). An LED chip(2) is mounted on the bottom of the cavity. An encapsulant is formed to cover a bonding wire electrically connecting the LED chip to the first lead frame and the second lead frame. An optical fiber bundle(30) is combined with the encapsulant. The encapsulant is made of a light transmissive material including at least one fluorescent substance. The gap of the optical fiber bundle is filled with the light transmissive material.</p>
