| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a polyimide precursor composition and a method for producing it, which can be cured at low temperature (250°C or lower) and has low viscosity despite its high concentration; a polyimide coating film, formed of the polyimide precursor composition and having good physical properties, and a method for producing it; and a photosensitive resin composition using the polyimide precursor composition and a method for producing it. <P>SOLUTION: The polyimide precursor composition comprises an imidized tetracarboxylic acid having an ether bond inside the molecule of a specific structure, and a diamine having an ether bond inside the molecule of a specific structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
