发明名称 |
METHOD AND SYSTEM FOR DEFECT DETECTION IN MANUFACTURING INTEGRATED CIRCUITS |
摘要 |
Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.
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申请公布号 |
US2010004775(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20080258786 |
申请日期 |
2008.10.27 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
LIN PAUL KUANG-CHI;ZHANG SOPHIA |
分类号 |
G06N5/02;G06F17/30;G06F17/40;G06F19/00 |
主分类号 |
G06N5/02 |
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