| 摘要 |
An apparatus comprising: a substrate comprising a first surface, a second surface, and an aperture passing from the first surface to the second surface; a microelectronic component comprising a back surface and a front surface, the front surface of the microelectronic component coupled to the first surface of the substrate and located to cover the aperture of the substrate; and a heat dissipation device coupled to the back surface of the microelectronic component. |
