| 摘要 |
PURPOSE: A semiconductor package is provided to improve electrical connection reliability of the semiconductor package by preventing a crack of a semiconductor chip generated by the thermal expansion coefficient difference between metal materials of the penetration electrode and the silicon comprising the semiconductor chip. CONSTITUTION: A semiconductor chip has a plurality of bonding pads(112). A penetration electrode is electrically connected to a bonding pad in the semiconductor chip. The penetration electrode includes conductors(122) and porosity formed by the conductors. |
