| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which sets a cup having a function of a reflecting plate in a molding metal mold with high precision in the case of a resin molding processing, and also to provide an optical semiconductor package which prevents the peeling of a sealing resin of light transparency which seals a semiconductor light emitting element. <P>SOLUTION: The lead frame 50 integrally includes: first and second leads 34 and 35; a cup 36 which reflects light emitted from a semiconductor light emitting element; and a suspension lead 37 holding the cup 36, wherein the cup 36 is held between the first and second leads 34 and 35 by the suspension lead 37. <P>COPYRIGHT: (C)2010,JPO&INPIT |
