| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing crush of a solder ball connecting a semiconductor component to a circuit board. <P>SOLUTION: This semiconductor device is formed by connecting the circuit board 6 to the semiconductor component 3 through a plurality of conductive metal bumps, and characterized in that Cu core balls 4 and solder balls 5 are mixed and arranged as the metal bumps; the Cu core balls 4 are used at least for the metal bumps arranged at a central part 7 of the arrangement; and the solder balls 5 are used at least for four of the metal bumps respectively arranged at corners C1-C4 in the outermost peripheral row. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
