METHOD FOR FORMING COPPER FILM, AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To solve a problem of a conventional method for forming a copper film that the copper film formed on a flat surface of a resin substrate or a resin layer has an insufficient adhesion strength. SOLUTION: This method for forming the copper film includes: irradiating one surface of the resin layer made from an epoxy resin with plasma while keeping the layer in a flat state; applying 1-vinylimidazole onto the surface; subsequently irradiating the surface of the resin layer with an ultraviolet ray; forming a thin copper film on the surface of the resin layer with an electroless copper-plating technique; forming the copper film with a predetermined thickness by electrolytically plating copper onto the thin copper film while using the thin copper film as a power-supplying layer; and then heat-treating the resin layer and the copper film so as to improve a peel strength between the copper film and the resin layer. COPYRIGHT: (C)2010,JPO&INPIT