发明名称 |
SELECTIVE SOLDERING SYSTEM |
摘要 |
A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
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申请公布号 |
US2010001039(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20090556955 |
申请日期 |
2009.09.10 |
申请人 |
SONY CORPORATION AND SONY ELECTRONICS INC. |
发明人 |
SERRANO ESTEBAN ARTURO ALVAREZ;FONSECA JULIAN MARTINEZ;SANCHEZ ROMAIN ARMANDO MILLAN |
分类号 |
B23K37/047 |
主分类号 |
B23K37/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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