发明名称 SELECTIVE SOLDERING SYSTEM
摘要 A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
申请公布号 US2010001039(A1) 申请公布日期 2010.01.07
申请号 US20090556955 申请日期 2009.09.10
申请人 SONY CORPORATION AND SONY ELECTRONICS INC. 发明人 SERRANO ESTEBAN ARTURO ALVAREZ;FONSECA JULIAN MARTINEZ;SANCHEZ ROMAIN ARMANDO MILLAN
分类号 B23K37/047 主分类号 B23K37/047
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