发明名称 |
SEPARATING APPARATUS AND SEPARATING METHOD |
摘要 |
A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes 3 and 3' for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes 3 and 3' has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.
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申请公布号 |
US2010000680(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20090492620 |
申请日期 |
2009.06.26 |
申请人 |
INAO YOSHIHIRO;NAKAMURA AKIHIKO;IWATA YASUMASA |
发明人 |
INAO YOSHIHIRO;NAKAMURA AKIHIKO;IWATA YASUMASA |
分类号 |
B32B38/10 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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