发明名称 LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED for preventing cracks from occurring in a coating material composed of glass, namely an inorganic material. <P>SOLUTION: In a first lead frame 12 for mounting an LED chip, a nearly funnel-shaped recess, where the pore size gradually expands upward from the bottom section, is provided, and a reflector 14 is formed with the inner surface of the recess as a reflection surface. On the bottom surface of the reflector 14, the LED chip 16 emitting short-wavelength light is connected and fixed by die bonding, and the LED chip 16 is coated for sealing with a coating member 22 composed of sol-gel glass to which a light-transmitting plasticizer 25 is added. Also, a phosphor 24 for wavelength conversion, which converts short-wavelength light emitted from the LED chip 16 to visible light having a prescribed wavelength, is mixed into the coating member 22 in a dispersed state. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010003786(A) 申请公布日期 2010.01.07
申请号 JP20080159910 申请日期 2008.06.19
申请人 OKAYA ELECTRIC IND CO LTD 发明人 RAIKUBO AKIHITO;KATO AKIHIRO
分类号 H01L33/48 主分类号 H01L33/48
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