| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency module which can be made thin. <P>SOLUTION: A high frequency module includes a case having a case frame 3, covers 4 and 5, and a middle board 2 which is arranged on the inside of the case frame 3 and partitioning the internal space surrounded by the case frame 3 and the covers 4 and 5 into upper and lower spaces, a high frequency circuit board 6 which is contained in the upper space in such a manner that high frequency circuit components 8a and 8b are arranged on the upper side and the opposite side faces the middle board 2, and a power supply control circuit board 7 which is contained in the lower space in such a manner that the high profile component 11 out of power supply control circuit components for supplying power to the high frequency circuit components 8a and 8b and controlling power supply thereto is arranged on the upper side while other components 12a, 12b except the high profile component 11 are arranged on the opposite side, i.e., the backside, facing the middle board 2, wherein the middle board 2 is provided with an opening 13 which interconnects the upper and lower spaces, and the high profile component 11 on the power supply control circuit board 7 projects from the opening 13 to the upper space side. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
