| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the heat dissipation effect of circuit components while realizing further thinning in comparison with a configuration of mounting the circuit components on both faces of a printed wiring board. <P>SOLUTION: The discharge lamp lighting device is equipped with a circuit block 1 comprised by mounting a plurality of the circuit components on a first printed wiring board 2 and a second printed wiring board 3, and a support member 4 supporting the circuit block 1. The surface mounting type circuit components 5 and the second printed wiring board 3 are mounted only on a mounting face 2a of the first printed wiring board 2. The circuit components 6 other than the surface mounting types are mounted only on the second printed wiring board 3. By this, a non-mounting face 2b of the first printed wiring board 2 can be abutted on the support member 4, and further thinning can be possible in comparison with the conventional configuration of mounting the circuit components on both faces of the printed wiring board. By conducting heat generated in the circuit components to the support member 4 from a whole face of the non-mounting face 2b, the heat dissipation effect with respect to the circuit components can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT |
