发明名称 PLASMA CVD FILM DEPOSITION METHOD AND PLASMA CVD APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma CVD film deposition method and a plasma CVD apparatus capable of suppressing damages of a substrate attributable to the heat and reactive gas ions in the capacitively coupled plasma CVD, and depositing a dense film of excellent quality with the high coatability. SOLUTION: The high frequency power having the frequency of HF-VHF band is supplied to a first electrode with a substrate being arranged thereon, and the power having the frequency which is lower than that of the power to be supplied to the first electrode and≤13.56 MHz or the DC pulse power of the pulse frequency is supplied to solve the problem. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010001551(A) 申请公布日期 2010.01.07
申请号 JP20080163489 申请日期 2008.06.23
申请人 FUJIFILM CORP 发明人 TAKAHASHI TOSHIYA
分类号 C23C16/509 主分类号 C23C16/509
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