| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which even an integrated circuit having no redundancy circuit mounted can be made redundant, and to provide a method of making it redundant. SOLUTION: The semiconductor device 10 has a wafer WFA where a first circuit block 11a is formed, and a redundancy circuit block 20 disposed overlapping the wafer WFA at a predetermined interval. Then the first circuit block 11a has a terminal for changing the input/output destination of a signal to be input to and output from the first circuit block 11a from the first circuit block 11a to the redundancy circuit block 20, and a conductive connection portion (bump) securing the interval between the wafer WFA and redundancy circuit block 20 during the switching from the first circuit block 11a to the redundancy circuit block 20. At this time, the connection portion is formed between the terminal and a predetermined terminal of a second circuit. COPYRIGHT: (C)2010,JPO&INPIT |
