发明名称 |
METALLIC PASTES AND INKS |
摘要 |
A metallic composition including a solvent and a plurality of metal nanoparticles dispersed therein is formulated such that curing of the metallic composition on a substrate provides a metallic conductor with a resistivity of about 5x10-4 Omega.cm or less. Electrical components of an assembly can be interconnected by a metallic conductor formed by curing the metallic composition on a substrate. A metallic composition including metal nanoparticles can be deposited on a substrate and solidified. The metallic composition can be contacted with a metal wire before or after solidification of the metallic composition and secured to the solidified metallic composition.
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申请公布号 |
US2010000762(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20090496453 |
申请日期 |
2009.07.01 |
申请人 |
APPLIED NANOTECH HOLDINGS, INC. |
发明人 |
YANG MOHSHI;ROUNDHILL DAVID MAX;YANIV ZVI |
分类号 |
H01B5/00;C09D5/00;H01R43/00 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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