| 摘要 |
PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to improve reliability of the stacked semiconductor package by electrically connecting a plurality of semiconductor chips without an additional conductive wire or penetration electrode. CONSTITUTION: In a first semiconductor chip(100), a first semiconductor chip body includes a first region and a second region arranged along the first region. First bonding pads are arranged on the first region. First re-wirings are electrically connected to the first bonding pads and are extended to the second region. Connection electrodes(200) are arranged in a part of the first re-wiring arranged on the second region. In a second semiconductor chip(300), a second semiconductor chip body is arranged on the first region. Second bonding pads are arranged on the upper side of the second semiconductor chip body. The second bonding pads are electrically connected to the second re-wirings, are extended to the side surface in contact with the upper side, and are electrically connected to each connection electrode.
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