| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of rolloff at an edge part of a wafer, by utilizing sheet etching, promoting iterative use of etching liquid used for it, relating to a semiconductor wafer along with its manufacturing method and manufacturing device. SOLUTION: The manufacturing method of a semiconductor wafer comprises a sheet-etching step in which an etching liquid is jetted to the surface of a wafer, while it is rotated for performing etching. The sheet-etching step comprises a first etching step in which etching is performed on the surface of a wafer under, such a condition as suppresses initial reaction after etching, is started at the outer peripheral part of the wafer only, during a predetermined period after the start of etching, and a second etching step in which, after the first etching step, etching has been performed on the surface of the wafer so as to obtain a preset thickness distribution across the radial direction of the wafer. COPYRIGHT: (C)2010,JPO&INPIT
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