发明名称 VAPOR DEPOSITION SOURCE, AND VAPOR DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a vapor deposition source and a vapor deposition apparatus in which generation of splash is suppressed, and the vapor deposition rate is consistent. Ž<P>SOLUTION: A plurality of heating plates 1 consisting of a conductor are arranged in a crucible 8 in a superposed state with a space therebetween. A film material 5 is provided on each heating plate 1 in a mountable manner. Any film material 5 is not set on the heating plate 1 on the highest stage. When the magnetic field is formed by an induction coil 10, each heating plate 1 itself generates the heat uniformly by the dielectric heating, the mounted film material 5 is also uniformly heated, and the vapor deposition rate becomes consistent. Further, the film material 5 is formed thin, the temperature distribution in the material becomes substantially uniform, and generation of splash is suppressed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010001529(A) 申请公布日期 2010.01.07
申请号 JP20080161387 申请日期 2008.06.20
申请人 SEIKO EPSON CORP 发明人 AKAGAWA TAKU
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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