METHOD OF PREPARING AN ELECTRICAL INSULATION FILM AND APPLICATION FOR THE METALLIZATION OF THROUGH-VIAS

摘要

The present invention relates essentially to a method of preparing an electrical insulating film on the surface of an electrically conducting or semi­conducting substrate, such as a silicon substrate. According to the invention, this method comprises the following: a) said surface is brought into contact with a liquid solution comprising: a protic solvent, at least one diazonium salt, at least one in-chain polymerizable monomer soluble in said protic solvent, and at least one acid in an amount sufficient to stabilize said diazonium salt by adjusting the pH of said solution to a value below 7, preferably below 2.5; and b) said surface is polarized in pulse potentiostatic or galvanostatic mode for a time sufficient to form a film having a thickness of at least 60 nanometres, and preferably between 80 and 500 nanometres. Application: metallization of through-vias, especially for 3-D integrated circuits.