METHOD FOR CREATING THROUGH HOLE IN PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for forming a through hole of a printed circuit board is provided to prevent break of a bit regardless of a diameter of a through hole using a laser drill process. CONSTITUTION: A CCL(Copper Clad Laminate)(100) is formed by stacking a copper foil(112) on both sides of an insulator(110). A part of one side of the insulator is removed using a laser mask. The insulator and a part of the copper foil in the other side of the insulator are removed by the laser drill process. The copper foil remaining on the other side of the insulator is removed by half etching. The copper foil on both sides of the insulator is electrically conducted with the electroless copper plating and the electrolytic copper plating.