ATOMIC LAYER DEPOSITION APPARATUS

摘要

PURPOSE: An apparatus for depositing an atomic layer is provided to prevent the inflow of the deposition gas from a spray region to an exhaust unit by arranging the spray region for spraying the deposition gas and the exhaust unit on different planes in a shower head. CONSTITUTION: A susceptor(120) is rotatably included in a process chamber. One substrate or more are received in the susceptor. A shower head is included on an upper side of the substrate. A plurality of spray regions for spraying the deposition gas to the substrate are formed on the shower head. An exhaust unit(150) is included in the shower head and includes an exhaust line. The exhaust line includes a plurality of exhaust holes exhausting the exhaust gas from the processor chamber. A projection part(511) is included around the exhaust line and is protruded from the surface of the shower head with a preset height.