| 摘要 |
PURPOSE: A semiconductor package is provided to operate stacked semiconductor chips at high speed by stacking a plurality of semiconductor chips and electrically connecting each semiconductor chip. CONSTITUTION: A first substrate has a substrate body and connection pads arranged on both edges of the upper side of the substrate body. A second substrate has a first surface, a second surface opposite to the first surface, a first circuit pattern arranged on the first surface and a second circuit pattern arranged on the second surface. A first semiconductor chip(30) is boned with the first circuit pattern with a flip chip method. A second semiconductor chip(35) is electrically connected to the first circuit pattern and is bonded with the second circuit pattern with the flip chip method. A connection unit(40) of a pin shape electrically connects the first circuit pattern and the connection pads.
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