| 摘要 |
PURPOSE: A test socket which electrically connects the terminal of a semiconductor device and a pad of a test apparatus are provided to reduce the whole signal movement distance and simplify teh shape of the spring. CONSTITUTION: An upper housing(11) includes a first penetration hole in a location corresponding to the terminal of the semiconductor device. A lower housing(12) is arranged in the lower of the top Housing. It unites with the top housing. The lower housing includes the second penetration hole in the location corresponding to first penetration hole. A spring(20) is inserted into the first and the second penetration hole. The terminal and the pad are connected electrically. A fixing combining member(30) is arranged between the top Housing and lower housing.
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