| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the damages in the bonding part of a pad electrode and a bump electrode, and to widen the contact area of the wiring pattern of a circuit board and the bump electrode. Ž<P>SOLUTION: After laminating a support 15 through an adhesive layer 14 to a semiconductor substrate 10 where the pad electrode 12 is arranged, a first opening 10A is formed in an area superimposed with the pad electrode 12. Then, a protective film 16 is formed which covers the inside of the first opening 10A and the back surface of the semiconductor substrate 10 and has a second opening 16A on the pad electrode 12. Then, the bump electrode 18 is formed which includes conductive paste, covers the entire first opening 10A and second opening 16A, connects to the pad electrode 12 through the second opening 16A and projects higher than the protective film 16 on the back surface of the semiconductor substrate 10. Thereafter, a laminate including the semiconductor substrate 10 and the support 15 is diced along a dicing line DL passing on the bump electrode 18 into a semiconductor chip 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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