| 摘要 |
<p>Provided is a temperature adjusting mechanism, which can keep deviation of a temperature of a portion in contact with the temperature adjusting mechanism to be small by controlling the temperature accurately at a high speed. A semiconductor manufacturing apparatus using such temperature adjusting mechanism is also provided. A cooling jacket (6) is provided with a cooling channel (61), and a heat lane (62). The heat lane (62) is provided with a heat receiving section (63), and a heat dissipating section (64), and seals a two-phase condensable working fluid (hereinafter, referred to as the working liquid) in an annular fine tube which reciprocates between the heat receiving section and the heat dissipating section by returning therebetween. The heat dissipating section (64) is a portion to be cooled by the cooling channel (61), and the heat receiving section (63) is a portion having a temperature higher than that of the heat dissipating section (64). In the heat receiving section (63), heat is received, the working liquid is self-excited by nucleate boiling, and the working liquid transfers sensible heat while being circulated. Furthermore, in the heat receiving section (63), a liquid phase absorbs heat and the phase is transformed into a gaseous phase, and in the heat dissipating section (64), a gaseous phase dissipates heat and is cooled and condensed, the phase is transformed into a liquid phase, and latent heat is transferred by gas-liquid phase transformation. Heat is transferred between the heat receiving section (63) and the heat dissipating section (64), and the temperature is uniformized in a short time.</p> |
