ELECTRICAL INSPECTION SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: An electrical inspection substrate unit and a manufacturing method therefore are provided to prevent disconnection of silicon wafer pad by using glass ceramic layers. CONSTITUTION: An electricity probing board(1) comprises a multilayer ceramic substrate(4) and an electrode(5). The electrode is arranged on the multilayer ceramic substrate. The multilayer ceramic substrate has thermal expansion 3.0~4.0ppm /°C under a temperature of -50~150°C. The multilayer ceramic substrate has thermal expansionα1 under the temperature of -50~150°C. The silicon wafer has a coefficient of thermal expansionα2 under the same temperature of the multilayer ceramic substrate.