| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which eases a stress acting on a connecting portion between a substrate bearing a semiconductor element placed thereon and a mounting board connected to the substrate to achieve high connection quality and high productivity. SOLUTION: The semiconductor device includes the substrate 1, the semiconductor element 3 placed on the substrate 1, a sealing resin 2 formed to cover the semiconductor element, and a connection terminal 7 disposed on the backside of the substrate 1. An annual recess 8 is formed on the upper surface of the sealing resin 2. COPYRIGHT: (C)2010,JPO&INPIT |
