| 摘要 |
Provided is a semiconductor packaging applicable conductive composition using silver coated material flakes as a conductive filler, curable epoxy, acrylate, bismaleimide chemical,or the like or their combination as organic resin, and the method for preparing the same.The composition is capable of showing desired workability as dispensible die attach adhesive with right rang of rheology, viscosity and physical stability in storing, being excellent in reliability of conductivity or corrosion resistance, and reducing the amount of high price silver in composition. |
