| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip that is mounted with high reliability, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor chip 30 and a substrate 50 are different in coefficient of thermal expansion, and stress is generated between the semiconductor chip 30 and substrate 50 with heat generated when the semiconductor chip 30 operates, but the stress is absorbed by a second insulating layer 236 having flexibility and a copper-plated post 239 having elasticity to eliminate cracking of an electric connection portion, thereby obtaining high connection reliability between the semiconductor chip 30 and substrate 50. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
