| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an excellent epoxy resin sheet member for sealing a semiconductor which is extremely small in occurrence of defects (non-filling, gold wire deformation, void occurrence, semiconductor movement and the like) in molding, in resin sealing by pressure-bonding molding of a semiconductor element; and a manufacturing method thereof. <P>SOLUTION: This epoxy resin sheet member for sealing a semiconductor: is formed by melting and kneading at least (A) powder and/or an atomized body of crystalline polyalphaolefin having a melting point of 30-90°C and particle diameters≤50μm, (B) an epoxy resin and (C) an inorganic filler; and has a sealing layer formed of a sealing material containing 0.2-5 mass% of crystalline polyalphaolefin. The epoxy resin sheet member for sealing a semiconductor further has protective film(s) on one surface or both surfaces of the sealing layer. This manufacturing method of the epoxy resin sheet member includes processes of: manufacturing the sealing material by spraying the crystalline polyalphaolefin having a melting point of 30-90°C in a molten state; and forming a separation layer by applying or spraying, to the protective film, the crystalline polyalphaolefin having a melting point of 30-90°C in a molten state. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
