发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically short-circuited to any other conductive part are provided. An inner lead portion has a tip arranged outside the outer circumferential end of the semiconductor chip as viewed on a plane. A power supply bar has a jutted portion extended between the outer circumferential end of the semiconductor chip and the tip of the inner lead portion as viewed on a plane. The upper face of the jutted portion is in a position lower than the upper face of the tip of the inner lead portion. A bonding wire for electrically coupling the semiconductor chip and the inner lead portion with each other has a bent portion outside the outer circumferential end of the semiconductor chip as viewed on a plane.
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申请公布号 |
US2010001386(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20090463850 |
申请日期 |
2009.05.11 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MISUMI KAZUYUKI;FUKUDOME KATSUYUKI;HATAUCHI KAZUSHI;FUKUHARA KAZUYA;YAMASHITA KUNIHIRO |
分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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