发明名称 |
ELECTRONIC DEVICE AND MANUFACTURING THEREOF |
摘要 |
An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering the power semiconductor chip. The body defines a second plane parallel to the first plane and side faces extends from the first plane to the second plane. At least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 60% of the distance between the first plane and the second plane.
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申请公布号 |
US2010001291(A1) |
申请公布日期 |
2010.01.07 |
申请号 |
US20080168254 |
申请日期 |
2008.07.07 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF;HOEGLAUER JOSEF |
分类号 |
H01L23/02;H01L21/52;H01L29/16 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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