| 摘要 |
A display device includes a glass substrate having a display area and a peripheral area. A drive circuit component is mounted on the glass substrate by thermocompression bonding on the peripheral area, and a stress absorption region is provided within the glass substrate close to the circuit component so as to absorb stress produced by thermal deformation of the circuit component. A method of manufacturing the display device of the present invention includes a step of forming stress absorption region into the glass substrate so as to absorb the stress caused by thermocompression bonding of the the circuit component.
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