PLANAR ELECTRICAL POWER ELECTRONIC MODULES FOR HIGH-TEMPERATURE APPLICATIONS, AND CORRESPONDING PRODUCTION METHODS

摘要

The present invention relates to an electronic component, in particular a power module, and to a corresponding method for producing or contact-connecting said component. The invention is distinguished by the fact that the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of > 175°C.