| 摘要 |
A die mounting apparatus is provided with a distance acquiring means for acquiring a distance, which is along a descending direction of a collet (13) and between a surface (24) on a side whereupon a bump (23) of a semiconductor die (21) sucked by a collet (13) is formed and a surface (34) on the side whereupon a bump (33) of a substrate (31) is formed. The die mounting apparatus is also provided with an aligning means for aligning the bump (23) of the semiconductor die (21) with the bump (33) of the substrate (31) by making the collet (13) stop sucking the semiconductor die (21), after bringing down the collet (13) toward the substrate (31) until the leading end of the bump (23) of the semiconductor die (21) sucked by the collet (13) is brought directly above the leading end of the bump (33) of the substrate (31), corresponding to the distance acquired by the distance acquiring means. Thus, crushing of the bumps is suppressed at the time of aligning the bumps formed by using a metal nanoink. |
