发明名称 FLEXIBLE CIRCUIT BOARD MODULE AND ITS MANUFACTURING METHOD
摘要 <p>For example, at an end part of a substrate body (1) constituting a display, a wiring (2) formed on a substrate body side is connected to a wiring (8) formed on a flexible circuit board (6) side through an anisotropic conductive film (5). The anisotropic conductive film connects the wiring (2) formed on the substrate body (1) side with the wiring (8) on the flexible circuit board (6) side, and is formed to protrude from the end part of the substrate body. A protruding portion (5a) from the end part of the substrate body of the anisotropic conductive film is stuck on the flexible circuit board covering a part of a cover lay (9) for covering the wiring of the flexible circuit board. At the protruding portion of the anisotropic conductive film, the flexible circuit board is folded toward the substrate body side.</p>
申请公布号 WO2010001448(A1) 申请公布日期 2010.01.07
申请号 WO2008JP61832 申请日期 2008.06.30
申请人 PIONEER CORPORATION;TOHOKU PIONEER CORPORATION;MIYAMURA, KOJI;AJIKI, TAKAYUKI 发明人 MIYAMURA, KOJI;AJIKI, TAKAYUKI
分类号 H05K1/14;H05K1/11;H05K3/36;H05K3/40 主分类号 H05K1/14
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