| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve successful propagation characteristics of a high frequency signal between dielectric substrates irrespective of a contact state between a housing substrate and the dielectric substrate. <P>SOLUTION: In high frequency mounting structure on the surface of which microstrip conductors 3a, 3b, a pair of ground conductors 4a, 4b, 5a, 5b are formed, on the backside of which solid ground conductors 7, 8 are formed, which has two dielectric substrates 1, 2 formed by connecting the ground conductors 4a, 4b, 5a, 5b on the surface and the ground conductors 7, 8 on the backside to one another by ground vias 9a, 9b, 10a, 10b, and the housing substrate 11, and in which the microstrip conductors 3a, 3b and the pair of ground conductors 4a, 4b, 5a, 5b are connected to one another by connection conductors 6a-6c, on the backsides of the two dielectric substrates 1, 2, the ground conductors are formed in a region other than the one from the end of the substrate to front positions of the ground vias 9a, 9b, 10a, 10b, and the dielectric substrates are exposed in the region. <P>COPYRIGHT: (C)2010,JPO&INPIT |
