发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To solve a problem wherein, when a laminating/sequential press-bonding process is employed for manufacturing a multilayer ceramic electronic component with a dummy conductor formed on an outer layer part for increasing fixation force to a ceramic element of an external terminal electrode having a base plated film, a dummy pattern on a ceramic green sheet laminated in a relatively initial stage is largely extended relative to that laminated in a relatively posterior stage, and it becomes difficult to form an external terminal electrode having a straight edge part. <P>SOLUTION: In this multilayer ceramic electronic component, the widths of dummy conductor patterns 57, 58 on a ceramic green sheet 54 which are laminated in a relatively initial stage in a laminating/sequential press-bonding process are set smaller than those of dummy conductor pattern 55, 56 on the ceramic green sheet which are laminated in a relatively posterior stage. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010003891(A) 申请公布日期 2010.01.07
申请号 JP20080161569 申请日期 2008.06.20
申请人 MURATA MFG CO LTD 发明人 TANIGUCHI TAKUMI;MATSUMOTO HIROYUKI
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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